[QUALCOMM and QSound] today announced that QUALCOMM has licensed QSound's Q3D(TM) and QXpanderŽ technologies and will integrate these audio enhancers into select QUALCOMM Mobile Station Modem(TM) (MSM(TM)) chipsets. Q3D and QXpander, part of QSound's microQ family of audio components, can create a 3D audio effect with stereo headsets or just two speakers by expanding audio signals to create a much richer wireless audio experience. The software release incorporating QSound's QXpander technology will be available in the fourth quarter of calendar 2004, beginning with QUALCOMM's MSM6550(TM) chipset solution. The Q3D audio positional technology brings a surround-sound experience to the wireless device by controlling the position of virtual sound sources in the space around the listener's head. The QXpander technology simulates a wider sound-scape, enhancing wireless stereo audio quality by creating the sensation that the speakers are larger and farther apart than they actually are. QUALCOMM and QSound Collaborate to Deliver Advanced Audio to Wireless With microQ 3D Sound Solutions |
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