June 23, 2004

Q3D: 3D Audio from QUALCOMM and QSound

Posted at June 23, 2004 07:48 AM in BREW .
[QUALCOMM and QSound] today announced that QUALCOMM has licensed QSound's Q3D(TM) and QXpanderŽ technologies and will integrate these audio enhancers into select QUALCOMM Mobile Station Modem(TM) (MSM(TM)) chipsets. Q3D and QXpander, part of QSound's microQ family of audio components, can create a 3D audio effect with stereo headsets or just two speakers by expanding audio signals to create a much richer wireless audio experience. The software release incorporating QSound's QXpander technology will be available in the fourth quarter of calendar 2004, beginning with QUALCOMM's MSM6550(TM) chipset solution.
The Q3D audio positional technology brings a surround-sound experience to the wireless device by controlling the position of virtual sound sources in the space around the listener's head. The QXpander technology simulates a wider sound-scape, enhancing wireless stereo audio quality by creating the sensation that the speakers are larger and farther apart than they actually are.

Integrating Q3D and QXpander into QUALCOMM's chipset solutions enable wireless devices to provide rich 3D audio sound and superior audio quality, including emulating a live concert experience or an audio gaming reality that lets the consumer feel the sound effects. QUALCOMM's licensing agreement also includes QSound's psychoacoustic audio enhancement algorithms to analyze audio content and restore high and low frequencies; QSizzle(TM) enhances treble response, and QRumble(TM) enhances bass response.

QUALCOMM and QSound Collaborate to Deliver Advanced Audio to Wireless With microQ 3D Sound Solutions

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